Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations

Title
Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations
Authors
이은상
Keywords
Polishing pad Dressing Capacity Lifetime Machining reliability AE sensor
Issue Date
2013
Publisher
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
Series/Report no.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE; vol.66 startpage 82 endpage 94
Abstract
The purposeofthewaferpolishingprocessistoensurewideplanarization,uniformity,aprecisesurface finish andanon-defectivesurface.Itssignificanceisincreasingwiththetrendtowardlarge-diameter wafers.Thepolishingpadusedintheseprocessesisanimportantfactorthatinfluencesthewafer surface finish.Maintenanceofthepadcapacityplaysakeyroleinthemachiningofreliableelevations. If themachiningtimeincreases,thepadcapacitydecreases,creatingtheneedforasuitableshifttime.A rough padsurfaceconditioncancontainmicroscopicholesthatserveasanexhaustpathwayforminute chip particles.Suchparticlesbecomereactionmaterialsonthepadsurface. In thisstudy,adressingeffectonthemachiningcapacity,deformationdegreeandpadlifetimeare investigated.A300mmsiliconwaferwaspolishedandthedressingdefectandcontrolconditionwere comparedandanalyzedwithnochangeoftheothermachiningconditions.Thepadcapacityand lifetimewereevaluatedintermsofthepaddeformationdegree,padsurfacevariationandsiliconwafer surface finishundervariouspaddeformationconditions.Th
URI
http://dx.doi.org/10.1016/j.ijmachtools.2012.11.003
http://dspace.inha.ac.kr/handle/10505/31502
ISSN
0890-6955
Appears in Collections:
College of Engineering(공과대학) > Mechanical Engineering(기계공학) > Journal Papers, Reports(기계공학 논문, 보고서)
Files in This Item:
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