센서 신호를 이용한 실리콘 Wafer의 실시간 가공 상태 모니터링 및 최적 가공에 관한 연구=

Title
센서 신호를 이용한 실리콘 Wafer의 실시간 가공 상태 모니터링 및 최적 가공에 관한 연구=
Authors
황성철
Issue Date
2009
Publisher
인하대학교
Abstract
With swift development of ULSI, the device dimensions become smaller and smaller, and the sizes of the silicon wafer used as substrate materials become larger and larger. The requirements to total and local global planarization of silicon wafers are becom
Description
Chapter 1 Introduction = 1 1.1 Background of the study = 1 1.2 Purpose of the study = 2 Chapter 2 Final Wafer Polishing System = 6 2.1 Mechanism of the final wafer polishing = 6 2.2 Final wafer polishing system = 7 2.3 Final polishing experiments = 8
URI
http://dspace.inha.ac.kr/handle/10505/10577
Appears in Collections:
College of Engineering(공과대학) > Mechanical Engineering(기계공학) > Theses(기계공학 석박사 학위논문)
Files in This Item:
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