반도체 공정을 위한 Piezostack 젯팅 디스펜서 의 설계 및 제어=

DC FieldValueLanguage
dc.contributor.author구오흥-
dc.date.accessioned2010-10-16-
dc.date.available2010-10-16-
dc.date.issued2009en
dc.identifier.urihttp://dspace.inha.ac.kr/handle/10505/10566-
dc.descriptionCHAPTER 1 INTRODUCTION = 1 1.1 Application of Fluid Dispensing in Semiconductor Electronic Packaging = 1 1.2 Fluid Dispensing Technology = 2 1.3 Research Contributions = 4 1.4 Outline of Dissertation = 5 CHAPTER 2 MODELING OF UNSTEADY FLOW IN DISPENSI-
dc.description.abstractFluid dispensing is a method by which fluid materials such as epoxy, adhesive, encapsulant and hydrogel are delivered in a precisely controlled manner. In recent years, jetting dispensers have been widely used in many applications, especially in the semic-
dc.languageenen
dc.publisher인하대학교-
dc.subjectPiezostack-
dc.title반도체 공정을 위한 Piezostack 젯팅 디스펜서 의 설계 및 제어=-
dc.typePhD Thesis-
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College of Engineering(공과대학) > Mechanical Engineering(기계공학) > Theses(기계공학 석박사 학위논문)
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