대구경 웨이퍼 폴리싱의 가공 조건에 따른 표면 특성에 관한 연구=

Title
대구경 웨이퍼 폴리싱의 가공 조건에 따른 표면 특성에 관한 연구=
Authors
이정택
Keywords
300mm wafer polishing
Issue Date
2008
Publisher
인하대학교
Abstract
The wafer polishing is a essential process used in the fabrication of silicon wafers to achieve a globally planar and mirror-like wafer surface. The surface roughness in the wafer is depend on the surface properties of the carrier head unit along with oth
Description
Chapter 1. Introduction = 1 1.1 Background of study = 1 1.2 The aim of study = 2 Chapter 2. Basic principles = 6 2.1 Making silicon wafer = 6 2.2 The concept of wafer polishing = 7 Chapter 3. Wafer Polishing System = 13 3.1 300mm Wafer Polishing Syst
URI
http://dspace.inha.ac.kr/handle/10505/10526
Appears in Collections:
College of Engineering(공과대학) > Mechanical Engineering(기계공학) > Theses(기계공학 석박사 학위논문)
Files in This Item:
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