Browsing by Author : 김목순

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Showing results 1 to 10 of 10

Issue DateTitleAuthor(s)
2014-09Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG김목순
2014-09Effect of reflow temperature on the mechanical drop performance of Sn-Bi solder joint김목순
2014-07Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies김목순
2014-08Microstructure and compressive deformation of hypereutectic Al-Si-Fe based P/M alloys fabricated by spark plasma sintering김목순
2014-09Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints김목순
2014-07TiO2 나노입자가 혼합된 봉지재를 적용한 LED 패키지의 광효율 특성 평가김목순
2014-12X-선 투과검사를 이용한 저항 점용접부 품질평가기법김목순
2014-03접합 소재에 따른 고출력 플립칩 LED 패키지 특성 연구김목순
2014-10차체용 1.2GPa급 초고장력 TRIP강의 Weldbond 접합부의 기계적 거동김목순
2014-07플라즈마 유기막과 OSP PCB 표면처리의 Sn-Ag-Cu 솔더 접합 특성 비교김목순
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