Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG

DC FieldValueLanguage
dc.contributor.author김목순-
dc.date.accessioned2017-04-20T16:30:05Z-
dc.date.available2017-04-20T16:30:05Z-
dc.date.issued201411-
dc.identifier.issn0361-5235-
dc.identifier.other-INHA-TheeffectofbathlifeofNi(P)onthebrittle-fracturebehaviorofSn-3.0wt.%Ag-0.5wt.%Cu(SAC)/electrolessnickelimmersiongold(ENIG)wasevaluatedinthisstudy.ThebathlivesofNi(P)fortheENIGsurfacefinishinthisstudywerevariedfrom0to3metalturnover(MTO),whichwereindirectlyindicativeofNi(P)bathlife,with“0MTO”denotingtheas-make-upstateand“3MTO”denotingalmostwasteplatingsolution.TheSAC/ENIGsamplewhenNi(P)wasplatedinthe3MTObath(3MTOsample)hadthicker(Cu,Ni)6Sn5andP-richlayersthanwhenNi(P)wasplatedinthe0MTObath(0MTOsample).Thebrittle-fracturebehaviorofthe0and3MTOsampleswasevaluatedbyuseofaigh-speedshear(HSS)testwithastrainrateof0.1–2.0m/s.Theshearstrengthofthe0MTOsamplewashigherthanthatofthe3MTOsample.TheincidenceofbrittlefractureincreasedasthebathlifeofNi(P)ofENIG(=MTOofNi(P))increased.Observationbytransmissionelectronmicroscopy(TEM)revealednano-sizedvoids(orparticles)intheNi-Sn-Player.AstheMTOoftheNi(P)increased,thenumberofnano-sizedvoidsintheNi-Sn-PlayeroftheSAC/ENIGinterfaceincreased.Thepoorbrittle-fracturebehaviorofthe3MTOsampleoriginatedfromtheweakinterfaceatthethickP-richlayerandfromthelargenano-sizedvoids.-
dc.identifier.urihttp://dspace.inha.ac.kr/handle/10505/39836-
dc.description4457~4463-
dc.description.abstractJOURNAL OF ELECTRONIC MATERIALS-
dc.description.abstractVol43 no12 Startpage 4457 Endpage 4463-
dc.languageDOI: 10.1007/s11664-014-3395-8-
dc.publisherJOURNAL OF ELECTRONIC MATERIALS-
dc.relation.ispartofseries43권 12호-
dc.subjectPb-free solderbath lifeNi(P)Sn-3.0Ag-0.5Cuelectroless nickel immersion goldbrittle fracturehigh-speed shear testinterfacial microstructure-
dc.titleEffect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG-
dc.typeArticle-
dc.identifier.DOIThe effect of bath life of Ni(P) on the brittle-fracture behavior of Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC)/electroless nickel immersion gold (ENIG) was evaluated in this study. The bath lives of Ni(P) for the ENIG surface finish in this study were varied from 0 to 3 metal turnover (MTO), which were indirectly indicative of Ni(P) bath life, with “0 MTO” denoting the as-make-up state and “3 MTO” denoting almost waste plating solution. The SAC/ENIG sample when Ni(P) was plated in the 3 MTO bath (3 MTO sample) had thicker (Cu,Ni)6Sn5 and P-rich layers than when Ni(P) was plated in the 0 MTO bath (0 MTO sample). The brittle-fracture behavior of the 0 and 3 MTO samples was evaluated by use of a igh-speed shear (HSS) test with a strain rate of 0.1–2.0 m/s. The shear strength of the 0 MTO sample was higher than that of the 3 MTO sample. The incidence of brittle fracture increased as the bath life of Ni(P) of ENIG (= MTO of Ni(P)) increased. Observation by transmission electron microscopy (TEM) revealed nano-sized voids (or particles) in the Ni-Sn-P layer. As the MTO of the Ni(P) increased, the number of nano-sized voids in the Ni-Sn-P layer of the SAC/ENIG interface increased. The poor brittle-fracture behavior of the 3 MTO sample originated from the weak interface at the thick P-rich layer and from the large nano-sized voids.-
dc.contributor.alternativeWonil Seo, Kyoung-Ho Kim, Jung-Hwan Bang, Mok-Soon Kim, Sehoon Yoo-
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College of Engineering(공과대학) > Materials Science & Engineering (신소재공학) > Local Access Journal, Reports (신소재공학 논문, 보고서)
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