Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG

Title
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
Authors
김목순
Keywords
Pb-free solderbath lifeNi(P)Sn-3.0Ag-0.5Cuelectroless nickel immersion goldbrittle fracturehigh-speed shear testinterfacial microstructure
Issue Date
2014-11
Publisher
JOURNAL OF ELECTRONIC MATERIALS
Series/Report no.
43권 12호
Abstract
JOURNAL OF ELECTRONIC MATERIALSVol43 no12 Startpage 4457 Endpage 4463
Description
4457~4463
URI
http://dspace.inha.ac.kr/handle/10505/39836
ISSN
0361-5235
Appears in Collections:
College of Engineering(공과대학) > Materials Science & Engineering (신소재공학) > Local Access Journal, Reports (신소재공학 논문, 보고서)
Files in This Item:
There are no files associated with this item.

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse