Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

DC FieldValueLanguage
dc.contributor.author김목순-
dc.date.accessioned2017-04-20T16:30:03Z-
dc.date.available2017-04-20T16:30:03Z-
dc.date.issued201407-
dc.identifier.issn0925-8388-
dc.identifier.other-INHA-Thegrowthbehaviorsofvariousinterfacialintermetalliccompoundsformedatfine-pitchCu/Sn–AgpillarbumpsfabricatedonZn-andNi-sputteredCuunderbumpmetallurgies(UBMs)wereinvestigatedinthisstudy.Afterflip-chipbonding,ascallop-typelayeroftheintermetalliccompoundCu6Sn5wasformedatthepillarjointontheCuandCu/ZnUBMs,whilethejointontheCu/NiUBMexhibitedalayeroftheintermetalliccompound(Cu,Ni)6Sn5.Duringthermalaging,Cu6Sn5transformedintoCu3Sn,andKirkendallvoidswereformedattheCu/Cu3Sninterface.ThethicknessoftheCu3SnlayerintheCu/NiUBMwaslowerthanthoseintheCuandCu/Znsamples.Inaddition,theCu/NiUBMhadalowervoidarearatiothandidtheCuandCu/Znsamples,owingtothelowgrowthrateofCu3Sn.ThedieshearstrengthoftheCu/NiUBMwashigherthanthoseofCuandCu/ZnUBMs.Finally,withanincreaseintheagingtime,thefracturesitemovedfromtheCu6Sn5regiontotheCu/Cu3SninterfacefortheCuandCu/ZnUBMs.However,inthecaseoftheCu/NiUBM,fracturingoccurredintheCu6Sn5orCu3Snregion.-
dc.identifier.urihttp://dspace.inha.ac.kr/handle/10505/39835-
dc.description394~400-
dc.description.abstractJOURNAL OF ALLOYS AND COMPOUNDS-
dc.description.abstractVol616 Startpage 394 Endpage 400-
dc.publisherJOURNAL OF ALLOYS AND COMPOUNDS-
dc.relation.ispartofseries616-
dc.sourcehttp://dx.doi.org/10.1016/j.jallcom.2014.07.124-
dc.subjectIntermetallics-
dc.subjectKirkendall void-
dc.subjectCu pillar bump-
dc.subjectZinc-
dc.subjectNickel-
dc.subjectUnder bump metallurgy-
dc.titleInterfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies-
dc.typeArticle-
dc.identifier.DOIThe growth behaviors of various interfacial intermetallic compounds formed at fine-pitch Cu/Sn–Ag pillar bumps fabricated on Zn- and Ni-sputtered Cu under bump metallurgies (UBMs) were investigated in this study. After flip-chip bonding, a scallop-type layer of the intermetallic compound Cu6Sn5 was formed at the pillar joint on the Cu and Cu/Zn UBMs, while the joint on the Cu/Ni UBM exhibited a layer of the intermetallic compound (Cu, Ni)6Sn5. During thermal aging, Cu6Sn5 transformed into Cu3Sn, and Kirkendall voids were formed at the Cu/Cu3Sn interface. The thickness of the Cu3Sn layer in the Cu/Ni UBM was lower than those in the Cu and Cu/Zn samples. In addition, the Cu/Ni UBM had a lower void area ratio than did the Cu and Cu/Zn samples, owing to the low growth rate of Cu3Sn. The die shear strength of the Cu/Ni UBM was higher than those of Cu and Cu/Zn UBMs. Finally, with an increase in the aging time, the fracture site moved from the Cu6Sn5 region to the Cu/Cu3Sn interface for the Cu and Cu/Zn UBMs. However, in the case of the Cu/Ni UBM, fracturing occurred in the Cu6Sn5 or Cu3Sn region.-
dc.contributor.alternativeMi-Song Kim, Myoung-Seok Kang, Jung-Hwan Bang, Chang-Woo Leea, Mok-Soon Kim, Sehoon Yoo-
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College of Engineering(공과대학) > Materials Science & Engineering (신소재공학) > Local Access Journal, Reports (신소재공학 논문, 보고서)
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