Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

Title
Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies
Authors
김목순
Keywords
Intermetallics, Kirkendall void, Cu pillar bump, Zinc, Nickel, Under bump metallurgy
Issue Date
2014-07
Publisher
JOURNAL OF ALLOYS AND COMPOUNDS
Series/Report no.
616
Abstract
JOURNAL OF ALLOYS AND COMPOUNDSVol616 Startpage 394 Endpage 400
Description
394~400
URI
http://dspace.inha.ac.kr/handle/10505/39835
ISSN
0925-8388
Appears in Collections:
College of Engineering(공과대학) > Materials Science & Engineering (신소재공학) > Local Access Journal, Reports (신소재공학 논문, 보고서)
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