Package-level integrated antennas based on LTCC technology

Title
Package-level integrated antennas based on LTCC technology
Authors
Koh, I.S.
Keywords
functional package, package-level integrated antenna, system-on-chip
Issue Date
2006-08
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Abstract
We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3 x 10.3 x 1.3 mm(3), and this package contains an 8.3 x 8.3 x 0.7 mm(3) internal space for the integration of chip-scale packaged components. The package is mounted on a 20 x 20 mm(2) ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.
URI
http://dspace.inha.ac.kr/handle/10505/1575
ISSN
0018-926X
Appears in Collections:
College of Information Technology & Engineering (IT공과대학) > Electronic Engineering (전자공학) > Journal Papers, Reports(전자공학 논문, 보고서)
Files in This Item:
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